ARIES 40 PIN ZIF SOCKET GOLD PLATED HOW TO
ARIES 40 PIN ZIF SOCKET GOLD PLATED DRIVER

So, I redesigned my driver board for my RGB matrix using some 16-pin SOICs.

ICs with fewer pins than those number will be narrow respectively and vice versa. As with 28-pin DIP ICs, 16-pin SOICs come in narrow and wide versions. ThatвЂ™s probably because all the SOICs I use thus far have more than 16 pins. I was aware that normal DIP ICs are wider for higher pin counts, but I stupidly assumed this wasnвЂ™t the case for SOICs. Great! That means one of these sockets is all one ever needs right? WRONG! As with DIL or DIP, the width of SOIC is not constant across all pin counts. To easily align a SOIC with fewer pins, just slide it to either end.ДЄs far as I am aware of, the maximum number of pins a SOIC can have is 28 (correct me if IвЂ™m wrong). With a SOIC of the same pin count, you can just drop it into the socket, no effort is required for alignment. Better yet, this allows one to use the 28-pin socket for a SOIC with fewer pins. Since each of the contacts individually clamp down on the respective pin, the socket can cope with variations in the dimensions or imperfections of the SOIC. Then, just gently release your hold and the contacts will clamp down on the pins. Make sure the SOIC sits flush in the recess and the pins are aligned with the contacts. While keeping it pressed down, place your SOIC in. When you do this, all the contacts move upwards and outwards. All you have to do is push down on the top-half of the socket.

ARIES 40 PIN ZIF SOCKET GOLD PLATED HOW TO

Info was scarce on eBay listings but you donвЂ™t have to be a вЂњrocket scientistвЂќ (why do people always say that?) to figure out how to use the sockets. IвЂ™d never actually seen one of these in person before and I really didnвЂ™t have any idea how it works before I received them. The pic above is a sequence of shots showing how one of these ZIF sockets work. I will definitely desolder the sockets later on and make my own breakout boards. The quality is horrible and plenty of residue flux around the solder joints. What I donвЂ™t like is the breakout boards that the sockets are soldered to. The sockets by themselves seem to be working great thus far. ItвЂ™s about USD20 for the 28-pin socket and USD10 for the 16-pin narrow version.

In fact, IвЂ™m pretty happy with what I got for the price I paid. BUT, YOU GET WHAT YOU PAID FOR! IвЂ™m not voicing dissatisfaction here. Now, IвЂ™m not racist here, but we all know a lot of products from China are pretty bad in quality. As IвЂ™ve mentioned, the sockets were from eBay, shipped from China. I also got another for 16-pin narrow SOIC. The one pictured above is for a 28-pin SOIC. WouldвЂ™ve saved me a lot of money and trouble. Should have gotten these a long time ago. Some manufacturers call it small outline package (SOP or even just SO) although, that shoud technically be referring to a smaller family of ICs (like SSOP or TSOP). IвЂ™ve just bought myself 2 ZIF sockets for small outline ICs (SOIC) from eBay. ThereвЂ™s no way to do that unless I solder the ICs onto at least a breakout board with header pins so that itвЂ™s breadboard friendly. ThatвЂ™s because I like to test out whatever new ICs I just bought. Since I started using more surface mount ICs, I tend to buy extras and also a bunch of breakout boards to go with it. IвЂ™ve always found those to be rather redundant, breadboards worked just fine for me. Most are familiar with ZIF sockets for DIP ICs. ZIF sockets are commonly used to program microcontrollers or to test ICs. Aries reserves the right to change product specifications without notice.ZIF stands for Zero Insertion Force. In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. Note: Aries specializes in custom design and production.

Contact Force = 9-12g per contact on 0.50 - 0.75mm pitchДЎ7-20g per contact on 0.80mm pitch or larger.

Compression spring probes are heat treated Beryllium Copper Alloy.

Estimated Contact Life: =500,000 cycles.

1dB Bandwidth at 1Ghz (0.80mm pitch) (large probe).

Molded socket components are UL94V-0 PEEK and/or Ultem.

Pressure pad compression spring provides proper force againstДevice and allows for height variations in device thickness.

Standard molded socket format can accommodate any device package.

Small witness marks on the bottom surface of the device solderballs. The gold over nickel plated compression spring probes leave very.Located by two molded plastic alignment pins and mounted Pressure mount compression spring probes which, are accurately Socket is easily mounted and removed to & from the BIB due to solderless.Single Point Probes available for small land area contact pads.4 Point crown insures вЂњscrubвЂќ on solder oxides.For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM.

Aries 40 pin zif socket gold plated